Although Turgeon Engineering does not
saw, dice and package ICs, it has close relationships with third party vendors that can provide this service.
Our familiarity and experience with their service can ensure that your needs will be met.
Service that we have provided includes
wafer dicing (whole or partial wafers), waffle or gel packs, and ceramics packages in any quantity.
By going through us, you can have a full
testing and packaging service.
For more information, check the following links:
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Site last updated Feb 6, 2013